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SI10U

K7

● 低CTE,高模量,可有用低落封装基板的翘直
优秀的耐湿热性
优越的PCB加工性
无卤质料


应用领域

Memory, CSP, BGA, POP类启装载板
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Items Condition Unit SI10U SI10U LC
Tg DMA 255 255
Td 5% wt. loss
>400 >400
T300
TMA min >60 >60
CTE (X/Y-axis) Before Tg ppm/℃
10 7
Dissipation Constant (1GHz) 2.5.5.9 - 4.6 4.2
Dissipation Factor (1GHz)
2.5.5.9 - 0.006 0.006
Peel Strength 12 um LP N/mm
0.8 0.8
Flexural Modulus A GPa
30 32
Water Absorption C-168/85/85 %
0.35 0.35
Flammability
UL-94 Rating
V-0 V-0
Heat Resistance 300℃/solder dip s
>300 >300
Heat Resistance after Moisture absorption
PCT 5h+288℃solder 20s
- Pass Pass
Halogen free
- - Yes
Yes
Glass
- - E glass Low CTE-glass

K7

1. These properties were measured with 0.80mm laminates except for XY-CTE that was measured with 0.10mm laminates.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.